International Radiation Detectors,
Inc.
Proper Use of the IRD
Photodiodes
1) AXUV/UVG/SXUV series photodiodes can be used in air,
in gas ambient like helium, argon, nitrogen, etc. and under
vacuum lower than 10-10 torr. Devices with suffix EUT need
to be selected for extremely low level vacuum applications
like 10-10 torr. IRD photodiodes can be vacuum baked up to
200ºC. They can be operated in the temperature range of
-200ºC to 70ºC.
2) It is advisable to check the photodiode for
functionality before placing it into the location of
measurement such as a vacuum chamber. Do this by connecting
the leads of the diode to the positive and negative
terminals of a picoammeter or electrometer and exposing the
diode to room light. As an example, an uncoated 1 cm x 1 cm
photodiode should produce an output current of 20 to 200
micro amperes depending on room light intensity. A filtered
photodiode should have an output current of less than a few
nano amperes. A table lamp or flashlight can also be used
to check the filtered diode functionality if room light
conditions do not produce a measurable output.
Warning:
Multimeters will give incorrect resistance readings for a photodiode, and should not be used to measure resistance or device functionality.
3) To avoid contribution of the photo emission current to
the photogenerated current, the signal should be read from
the p-region (anode) of the diode with n-region (cathode)
grounded. A significant photo emission current contribution
has been noticed in the AXUV diodes in 70 nm to 140 nm
region when the signal is read from the n-region with
p-region grounded.
4) Condensables within the vacuum system in which IRD
photodiodes are used must be maintained at as low a level as
possible. A surface film deposited on the diode will absorb
radiation and may even fluoresce. In either of these cases,
a permanent film could result from interaction with XUV
radiation leading to irreversible changes in device
efficiencies.
5) As the most of the IRD photodiodes are windowless
devices, precaution should be taken not to breathe, sneeze
or touch the active area of the devices. If by accident the
active area is contaminated, the surface can be cleaned by
an acetone or alcohol dipped swab. As the IRD diodes have
very shallow junction, the swabbing action should be gentle
without any pressure. All the filtered diodes with carbon
and silicon passivating coating (for example AXUV100 Mo/Si,
AXUV100 Ti/C etc.) can also be cleaned by the above method.
Please contact IRD for instructions on cleaning photodiodes
with other directly deposited filters.
6) Care must be taken to avoid disturbing the delicate
wire bonds which connect the photodiode chip to the package
pins. If the wire becomes pushed down against the chip, a
short will result. If this happens, use a fine wire or
needle to gently lift the wire bond away from the chip
surface (a microscope will usually be needed). If the wire
bonds are broken the device can be sent back to IRD for
repair. Most of the IRD photodiodes are assembled with
multiple bonds and in most cases, redundant pins. Only one
wire bond per pin is necessary for proper operation of the
device.
7) Most of the AXUV/UVG/SXUV diodes can be purchased with
protective epoxy on their wire bonds so that the bonds will
not brake if touched accidentally. However, the diodes whose
wire bonds are protected by epoxy need to be operated near
room temperature, i.e., one can not heat these devices for
out gassing purpose nor cool them to reduce the noise. This
is necessary to avoid generation of stress on the wires
because of difference in the Thermal Coefficient of
Expansion (TCE) between the wire and the epoxy.
8) Linear range of AXUV/UVG/SXUV diodes can be increased
several times by application of a small reverse bias. Thus,
under high level radiation condition, the diode saturation
can easily be checked by application of one to two volts
reverse bias. In extreme cases, in excess of one hundred
volts reverse bias is applied to the diodes to operate them
in the linear range. A simple series circuit of the voltage
source, diode and current measuring device is required when
the source is a CW source. Make sure the diode is reverse
biased and not forward biased as this may damage the diode.
When using the diodes for pulse energy measurements usually
an external bias T, like BT250 is required.
9) Care should be used while using the small active area
diodes like the AXUVHS5 as absolute devices. All the AXUV
products can be used as absolute devices provided that
radiation beam is limited to the diode active area. When the
diode is flooded (overfilled) with the beam, it is hitting
the diode periphery, the quantum efficiency of which in not
known. Detectors with active area as large as 24 mm x 24 mm
are available from IRD to make absolute intensity
measurement of large beams.
10) Since photodiodes are subject to damage by excessive
heat, care must be given to soldering temperature and dwell
time. As a guide, metal package devices should be soldered
at a maximum of 260 ºC within 10 seconds and ceramic
package devices at 260 ºC within 5 seconds at 2 mm
minimum distance from package base. Use acetone or alcohol
to remove solder flux. To avoid contamination of the active
area, the protective window shipped with the photodiode
should be left on during soldering.
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